Search Type: US Issued Patents

aclm/(nial or "ni.sub.3 al") AND aclm/alumina AND aclm/(conduct$ or superconduct$ or semiconduct$)

Classification	Number	Url	PMD	Priority	Assignee	Assignee Loc	Inventor(s)	Inventor Loc(s)	Filing Date	Issued Date
classification-0	6,179,953	Method for making electronic circuits having NiAl and Ni3Al substrates	6,179,953	Yes CROSS-REFERENCE TO RELATED APPLICATIONS This application is a divisional application of parent U.S. Application Ser. No. 08/969,665, "Electronic Circuits Having NiAl and Ni.sub.3 Al Substrates by Seetharama C. Deevi and Vinod K. Sikka filed on Nov. 13, 1997, now U.S. Pat. No. 5,965,274.	UT-Battelle, LLC	Oak Ridge, TN	Deevi; Seetharama C.:Sikka; Vinod K.	Midlothian, VA:Oak Ridge, TN	March 2, 1999	January 30, 2001
classification-0	5,965,274	Electronic circuits having NiAl and Ni.sub.3 Al substrates	5,965,274	No	Lockheed Martin Energy Research Corporation	Oak Ridge, TN	Deevi; Seetharama C.:Sikka; Vinod K.	Midlothian, VA:Oak Ridge, TN	November 13, 1997	October 12, 1999